Sensor module

ABSTRACT

Disclosed herein is a sensor module that includes a substrate having a top surface and a back surface, a sensor element mounted on the top surface of the substrate, an external terminal formed on the back surface of the substrate, and a case fixed to the substrate so as to cover the sensor element. The case has a top plate part having a plurality of through holes. The top plate part has a center area having no through holes and a through hole formation area having the plurality of through holes, the through hole formation area being positioned so as to surround the center area.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a Continuation of U.S. Pat. Application No. 17/360,063 filed onJun. 28, 2021, which claims the benefit of Japanese Patent ApplicationNo. 2020-123506 filed on Jul. 20, 2020 including the specification,drawings and abstract are incorporated herein by reference in theirentirety.

BACKGROUND OF THE INVENTION --Field of the Invention

The present invention relates to a sensor module and, more particularly,to a sensor module for detecting, e.g., a predetermined gas componentcontained in a measurement atmosphere.

--Description of Related Art

A gas sensor for detecting a predetermined gas component is described inJapanese Patent No. 4,280,705. The gas sensor described in JapanesePatent No. 4,280,705 includes a substrate having a cavity, a gasdetection element housed in the cavity, and a protective cap coveringthe cavity. The protective cap has a plurality of vent holes, throughwhich an external gas to be measured is introduced into the cavity.

In the gas sensor described in Japanese Patent No. 4,280,705, theprotective cap has, at its top, a planar portion having no vent hole.With the planar portion sucked by a suction nozzle of a chip mounter,the gas sensor is surface-mounted on a circuit board.

However, in the gas sensor described in Japanese Patent No. 4,280,705,the planar portion of the protective cap is formed eccentric to thecenter position, so that when it is sucked by the chip mounter suctionnozzle, the posture of the gas sensor may become unstable. Such aproblem may occur not only in the gas sensor but also in all the sensormodules that are surface-mountable on a circuit board, including, forexample, sensor modules for detecting vibration, pressure, andtemperature of air, which are specifically microphones, pressuresensors, and temperature sensors.

SUMMARY

It is therefore an object of the present invention, in a sensor modulesurface-mountable on a circuit board, to make the posture of the sensormodule more stable during a sucking process using the chip mountersuction nozzle while ensuring sufficient air circulation.

A sensor module according to the present invention includes: a substratehaving a top surface and a back surface; a sensor element mounted on thetop surface of the substrate; an external terminal formed on the backsurface of the substrate; and a case covering the sensor element fixedto the substrate. The case has a top plate part having a plurality ofthrough holes. The top plate part has a center area having no throughholes and a through hole formation area positioned so as to surround thecenter area and having the plurality of through holes.

According to the present invention, no through holes are formed in thecenter area of the top plate part, so that the center area can be suckedby a suction nozzle of a chip mounter, allowing the sensor module to besurface-mounted on a circuit board with a stable posture.

In the present invention, the top plate part may have a rectangularouter shape. This can maximize the volume of a space surrounded by thecase. In this case, the through hole formation area may include aclearance area having no through holes, and the clearance area may bepositioned in the vicinity of the corner portion of the top plate partor in the vicinity of substantially the center portion of the side ofthe top plate part. With this configuration, when the top plate partneeds to be held with a jig in an inspection process, the clearance areacan be held with the jig, thus preventing the through holes from beingclosed by the jig.

The sensor module according to the present invention may further includea filter overlapping the plurality of through holes. This can preventforeign matters from entering the space surrounded by the case. In thiscase, the filter may selectively cover the through hole formation areaso as to overlap the plurality of through holes without covering thecenter area. This can prevent contact between the filters and thesuction nozzle during the suction process using the chip mounter suctionnozzle.

Further, the filter may be formed as a single member having a continuousshape. This simplifies a filter attachment process and can enhanceattachment strength between the filter and the top plate part. In thiscase, the top plate part may include an attachment area covered with thefilter and a non-attachment area not covered with the filter, and theattachment area may overlap the through hole formation area, and thenon-attachment area may include the center area, an outside areapositioned outside the through hole formation area, and a separationarea overlapping the through hole formation area and connecting thecenter area and the outside area. With this configuration, in a processof removing an unnecessary part of a filter sheet that has been attachedto the top plate part, the unnecessary part that has been attached tothe outside area and the unnecessary part that has been attached to thecenter area can be removed in a single step.

As described above, according to the present invention, it is possibleto make the posture of the sensor module more stable during a suctionprocess using the chip mounter suction nozzle while ensuring sufficientair circulation.

BRIEF DESCRIPTION OF THE DRAWINGS

The above features and advantages of the present invention will be moreapparent from the following description of certain preferred embodimentstaken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic perspective view illustrating the outer appearanceof a sensor module 1A according to a first embodiment of the presentinvention;

FIG. 2 is a schematic exploded view of the sensor module 1A;

FIG. 3 is a schematic plan view of the sensor module 1A as viewed from aback surface;

FIG. 4 is a schematic plan view for explaining the shape of the topplate part 41 in more detail;

FIG. 5 is a schematic perspective view for explaining a conveying methodfor the sensor module 1A;

FIG. 6 is a schematic perspective view for explaining an inspectionmethod for the sensor module 1A;

FIG. 7 is a schematic perspective view illustrating the outer appearanceof a sensor module 1B according to a second embodiment of the presentinvention;

FIG. 8 is a schematic perspective view illustrating the outer appearanceof a sensor module 1C according to a third embodiment of the presentinvention;

FIG. 9 is a schematic perspective view illustrating the outer appearanceof a sensor module 1D according to a fourth embodiment of the presentinvention;

FIG. 10 is a schematic perspective view illustrating the outerappearances of sensor module 2A according to a fifth embodiment of thepresent invention;

FIG. 11 is a schematic perspective view illustrating the outerappearances of sensor module 2B according to a sixth embodiment of thepresent invention;

FIG. 12 is a schematic perspective view illustrating the outerappearances of sensor module 2C according to a seventh embodiment of thepresent invention;

FIG. 13 is a schematic perspective view illustrating the outerappearances of sensor module 2D according to an eighth embodiment of thepresent invention;

FIG. 14 is a schematic perspective view illustrating the outerappearances of sensor module 3A according to a ninth embodiment of thepresent invention;

FIG. 15 is a schematic perspective view illustrating the outerappearances of sensor module 3B according to a tenth embodiment of thepresent invention;

FIG. 16 is a schematic plan view illustrating the outer appearance of asensor module 3C according to an eleventh embodiment of the presentinvention;

FIG. 17 is a schematic plan view illustrating the outer appearance of asensor module 3D according to a twelfth embodiment of the presentinvention;

FIG. 18 is a schematic plan view illustrating the outer appearance of asensor module 3E according to a thirteenth embodiment of the presentinvention;

FIG. 19 is a schematic plan view illustrating the outer appearance of asensor module 4A according to a fourteenth embodiment of the presentinvention;

FIGS. 20 and 21 are schematic perspective views for explaining a part ofthe manufacturing process of the sensor module 4A according to thefourteenth embodiment;

FIGS. 22A to 22C are schematic views for explaining examples in whichthe edge portion of the filter 65 is chamfered;

FIGS. 23A and 23B are schematic views for explaining examples in whichthe width of the separation area 41D becomes wider from the center area41A toward the outside area 41C;

FIG. 24 is a schematic plan view illustrating the outer appearance of asensor module 4B according to a fifteenth embodiment of the presentinvention;

FIGS. 25A to 25C are schematic views for explaining examples in whichthe edge portion of the filter 65 is chamfered;

FIGS. 26A and 26B are schematic views for explaining examples in whichthe width of the separation area 41D becomes wider from the center area41A toward the outside area 41C; and

FIG. 27 is a schematic plan view illustrating the outer appearance of asensor module 4C according to a sixteenth embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Preferred embodiments of the present invention will be explained belowin detail with reference to the accompanying drawings.

First Embodiment

FIG. 1 is a schematic perspective view illustrating the outer appearanceof a sensor module 1A according to a first embodiment of the presentinvention. FIG. 2 is a schematic exploded view of the sensor module 1A.

As illustrated in FIGS. 1 and 2 , the sensor module 1A according to thefirst embodiment includes a substrate 10, a sensor chip 20 and a controlIC 30 which are mounted on a surface 11 of the substrate 10, and a case40 which is fixed to the substrate 10 and covers the sensor chip 20 andcontrol IC 30. As illustrated in FIG. 3 , the substrate 10 has aplurality of external terminals 13 on a back surface 12 thereof. Thesurface 11 and back surface 12 of the substrate 10 constitute the xyplane.

The sensor chip 20 has a sensor element for measuring the concentrationof a predetermined gas component (CO₂, etc.) contained in a measurementatmosphere. However, the sensor chip 20 may not necessarily be a gassensor but may be a sensor for detecting vibration, pressure,temperature, humidity, or the like of the air in a measurementatmosphere, which is specifically, a microphone, a pressure sensor, atemperature sensor, a humidity sensor, or the like. In the exampleillustrated in FIG. 2 , two sensor chips 20 are mounted on the substrate10; however, the number of the sensor chips 20 to be mounted on thesubstrate 10 is not limited to a particular value.

The control IC 30 is connected to the sensor chip 20 and has anintegrated control circuit for calculating measurement values based onthe output from the sensor chip 20. Although not particularly limited,the control IC 30 may be a semiconductor IC in a bare-chip state. Thecontrol IC 30 is also connected to the external terminals 13. Someexternal terminals 13 may be connected directly to the sensor chip 20.The sensor chip 20 and the control IC 30 may not necessarily beseparated chips, and an IC including a sensor element and a controlcircuit in one chip may be used.

The case 40 is made of a material having sufficient strength, such asmetal or resin, and includes a top plate part 41 facing the surface 11of the substrate 10 and a side plate part 42 connected to the top platepart 41 and surrounds the sensor chip 20 and control IC 30 in a planview (as viewed in the z-direction). The top plate part 41 is parallelto the surface 11 of the substrate 10 and constitutes the xy plane. Theside plate part 42 is perpendicular to the surface 11 of the substrate10 and constitutes the xz plane or yz plane. The top plate part 41 has aplurality of through holes 43. The through holes 43 allow air tocirculate therethrough from outside to inside of the case 40. Forexample, when the sensor chip 20 is a gas sensor, a gas component to bemeasured enters the inside of the case 40 through the through holes 43and is measured in concentration by the sensor chip 20. In the presentembodiment, the through hole 43 has a circular planar shape, whichminimizes a reduction in strength of the top plate part 41 due to thepresence of the through holes 43.

FIG. 4 is a schematic plan view for explaining the shape of the topplate part 41 in more detail.

As illustrated in FIG. 4 , the top plate part 41 has a rectangularplanar shape and includes a center area 41A having no through holes 43,a through hole formation area 41B surrounding the center area 41A, andan outside area 41C positioned outside the through hole formation area41B. The through holes 43 are all formed in the through hole formationarea 41B. That is, the center area 41A and outside area 41C have nothrough holes 43. Some through holes 43 may overlap the sensor chip 20or control IC 30 as viewed in the z-direction. The center position ofthe center area 41A coincides with the center position of the top platepart 41. The through hole formation area 41B has a ring shape andincludes a linear part 41B₁ in which three through holes 43 are arrangedin the x-direction or y-direction and a corner part 41B₂ connecting twolinear parts 41B₁. In the present embodiment, the corner part 41B₂ ispositioned in the vicinity of the corner portion of the top plate part41 and constitutes a clearance area having no through holes 43.

FIG. 5 is a schematic perspective view for explaining a conveying methodfor the sensor module 1A according to the present embodiment.

As illustrated in FIG. 5 , when the sensor module 1A is conveyed, asuction nozzle 50 of a chip mounter is used to suck the center area 41Aof the top plate part 41. As described above, no through holes 43 areformed in the center area 41A of the top plate part 41, thus allowingthe center area 41A to be sucked reliably by the suction nozzle 50.Moreover, the planar position of the center area 41A of the top platepart 41 is not eccentric, so that the posture of the sensor module 1A ina state of being sucked by the suction nozzle 50 can be made morestable. As a result, it is possible to stably perform the work ofsurface-mounting the sensor module 1A on a not-shown circuit substrate.

FIG. 6 is a schematic perspective view for explaining an inspectionmethod for the sensor module 1A according to the present embodiment.

As illustrated in FIG. 6 , in a process of inspecting the sensor module1A according to the present embodiment, a not-shown probe is broughtinto contact with the external terminal 13 on the back surface 12 in astate where the top plate part 41 of the case 40 is held by a pluralityof jigs 51 to 54. In this state, the concentration of a gas to bemeasured in the atmosphere is set to a known predetermined value, and itis determined whether a measurement value output from the externalterminal 13 indicates a correct value, whereby screening of the sensormodule 1A can be made.

The jigs 51 to 54 are disposed so as to cover the corner portions of thetop plate part 41 and their vicinities. The corner portions and theirvicinities are comparatively higher in strength against a force in thez-direction, thus preventing the sensor module 1A from being deformedand damaged during the inspection process. Although the jigs 51 to 54are disposed so as to partially cover the through hole formation area41B, they are disposed so as to each overlap the clearance area so asnot to close the through hole 43. This allows the inspection to beperformed under the same conditions as in actual use.

Second Embodiment

FIG. 7 is a schematic perspective view illustrating the outer appearanceof a sensor module 1B according to a second embodiment of the presentinvention.

The sensor module 1B illustrated in FIG. 7 differs from the sensormodule 1A according to the first embodiment in that the through hole 43has a vertically or horizontally elongated shape. Other configurationsare the same as those of the sensor module 1A according to the firstembodiment, so the same reference numerals are given to the sameelements, and overlapping description will be omitted. The through hole43 in the present embodiment has a shape obtained by connecting threethrough holes 43 arranged in the x-direction or y-direction illustratedin FIG. 4 . Using the through holes 43 having such a shape allowsgreater circulation of air from outside to inside of the case 40 whilemaintaining sufficient area of the center area 41A and outside area 41C.

Third Embodiment

FIG. 8 is a schematic perspective view illustrating the outer appearanceof a sensor module 1C according to a third embodiment of the presentinvention.

The sensor module 1C illustrated in FIG. 8 differs from the sensormodule 1A according to the first embodiment in that three through holes43 are arranged in an L-shape at the corner part 41B₂ of the throughhole formation area 41B. Other configurations are the same as those ofthe sensor module 1A according to the first embodiment, so the samereference numerals are given to the same elements, and overlappingdescription will be omitted. In the present embodiment, substantiallythe center portion of the linear part 41B₁ constitutes the clearancearea. The substantially center portion of the linear part 41B₁ ispositioned in the vicinity of substantially the center portion of theside of the top plate part 41. As exemplified in the present embodiment,the clearance area may not necessarily be provided at the corner part41B₂. Even with the configuration according to the present embodiment,it is possible to perform the inspection without closing the throughholes 43 by holding the clearance areas with the jigs 51 to 54.

Fourth Embodiment

FIG. 9 is a schematic perspective view illustrating the outer appearanceof a sensor module 1D according to a fourth embodiment of the presentinvention.

The sensor module 1D illustrated in FIG. 9 differs from the sensormodule 1C according to the third embodiment in that individual throughholes 43 have an L-shape. Other configurations are the same as those ofthe sensor module 1C according to the third embodiment, so the samereference numerals are given to the same elements, and overlappingdescription will be omitted. Using the through holes 43 having such ashape allows greater circulation of air from outside to inside of thecase 40.

Fifth to Eighth Embodiments

FIGS. 10 to 13 are schematic perspective views illustrating the outerappearances of sensor modules 2A to 2D according to fifth to eighthembodiments of the present invention.

The sensor modules 2A to 2D illustrated in FIGS. 10 to 13 differrespectively from the sensor modules 1A to 1D according to the first tofourth embodiments in that filters 61 to 64 are attached so as tooverlap the through holes 43. Other configurations of the sensor modules2A to 2D are the same respectively as those of the sensor modules 1A to1D according to the first to fourth embodiments, so the same referencenumerals are given to the same elements, and overlapping descriptionwill be omitted.

The filters 61 to 64 are each a member for preventing entering of apredetermined gas component that may deteriorate the sensor element,dust, and dirt. In the sensor modules 2A and 2B illustrated in FIGS. 10and 11 , the filters 61 to 64 are attached along the linear part 41B₁ ofthe through hole formation area 41B. In the sensor modules 2C and 2Dillustrated in FIGS. 12 and 13 , the filters 61 to 64 are attached alongthe corner part 41B₂ of the through hole formation area 41B. Since thefilters 61 to 64 selectively cover the through hole formation area 41Bwithout covering the center area 41A, the suction nozzle 50 of the chipmounter can avoid contacting the filters 61 to 64, thereby preventingthe filters 61 to 64 from being damaged during a mounting process.

The filters 61 to 64 can be attached as follows. A filter sheet havingcuts along which the filters 61 to 64 can be separated one from anotheris attached to the top plate part 41, and an unnecessary part of thefilter sheet is removed so as to leave the filters 61 to 64 on the topplate part 41. This method can reduce the number of processes ascompared to when the filters 61 to 64 are individually attached.

Ninth and Tenth Embodiments

FIGS. 14 and 15 are schematic perspective views illustrating the outerappearances of sensor modules 3A and 3B according to ninth and tenthembodiments of the present invention.

The sensor modules 3A and 3B illustrated in FIGS. 14 and 15 differrespectively from the sensor modules 2A and 2B according to the fifthand sixth embodiments in that a single ring-shaped filter 65 is used.Other configurations of the sensor modules 3A and 3B are the samerespectively as those of the sensor modules 2A and 2B according to thefifth and sixth embodiments, so the same reference numerals are given tothe same elements, and overlapping description will be omitted.

As exemplified in the ninth and tenth embodiments, the filter to beattached to the top plate part 41 may be a signal member having acontinuous shape. In this case, attachment strength between the topplate part 41 and the filter can be enhanced due to an increase in theattachment area. To further enhance the attachment strength, the filtermay be attached to the entire inner surface (the surface of the topplate part 41 that faces the surface 11 of the substrate 10). The outerand inner shapes of the filter 65 are each not a quadrangle, but anoctagon so as to sufficiently separate the filter 65 from the cornerportions of the top plate part 41. This can prevent contact between thejigs 51 to 54 and the filter 65 during the inspection processillustrated in FIG. 6 .

The filter 65 can be attached as follows. A filter sheet having cuts isattached to the top plate part 41, and an unnecessary part of the filtersheet positioned in the center area 41A and an unnecessary partpositioned in the outside area 41C are removed so as to leave the filter65 on the top plate part 41.

Eleventh Embodiment

FIG. 16 is a schematic plan view illustrating the outer appearance of asensor module 3C according to an eleventh embodiment of the presentinvention.

The sensor module 3C illustrated in FIG. 16 differs from the sensormodule 3A according to the ninth embodiment in that the inner shape ofthe filter 65 is a quadrangle, and the outer shape thereof is a hexagon.Other configurations are the same as those of the sensor module 3Aaccording to the ninth embodiment, so the same reference numerals aregiven to the same elements, and overlapping description will be omitted.As illustrated in FIG. 16 , the filter 65 has a two-fold symmetric shapein which vicinities of the two diagonally facing corners of the topplate part 41 are cut. When the filter 65 having such a shape is used,the two jigs 52 and 53 which are positioned diagonally can be used inthe inspection process illustrated in FIG. 6 so as not to contact thefilter 65. Thus, the filter 65 need not be offset from the vicinities ofall the four corners of the top plate part 41, but may be offset fromthe vicinities of only the two diagonally facing corners thereof.

Twelfth Embodiment

FIG. 17 is a schematic plan view illustrating the outer appearance of asensor module 3D according to a twelfth embodiment of the presentinvention.

The sensor module 3D illustrated in FIG. 17 differs from the sensormodule 3C according to the eleventh embodiment in that the filter 65 hasa four-fold symmetric shape with a quadrangular outer shape and with thevicinity of substantially the center portion of each side of the topplate part 41 cut. Other configurations are the same as those of thesensor module 3C according to the eleventh embodiment, so the samereference numerals are given to the same elements, and overlappingdescription will be omitted. When the sensor module 3D according to thetwelfth embodiment is inspected, the cut portions of the filter 65 areheld with the jigs 51 to 54, whereby it is possible to perform theinspection while preventing closing of the through holes 43 andpreventing contact between the jigs 51 to 54 and the filter 65.

Thirteenth Embodiment

FIG. 18 is a schematic plan view illustrating the outer appearance of asensor module 3E according to a thirteenth embodiment of the presentinvention.

The sensor module 3E illustrated in FIG. 18 differs from the sensormodules 3A to 3D according to the ninth to twelfth embodiments in thatthe top plate part 41 of the case 40 has a circular shape and that thefilter 65 has a three-fold symmetric shape. Other configurations are thesame as those of the sensor modules 3A to 3D according to the ninth totwelfth embodiments, so the same reference numerals are given to thesame elements, and overlapping description will be omitted. The filter65 has three cuts. When the sensor module 3E is inspected, the three cutportions of the filter 65 are held with three jigs to fix the sensormodule 3E. As exemplified in the present embodiment, the top plate part41 of the case 40 may not necessarily have a rectangular shape in thepresent invention. Using the case 40 having the circular top plate part41 can further enhance mechanical strength.

Fourteenth Embodiment

FIG. 19 is a schematic plan view illustrating the outer appearance of asensor module 4A according to a fourteenth embodiment of the presentinvention.

The sensor module 4A illustrated in FIG. 19 differs from the sensormodule 3A according to the ninth embodiment in that the filter 65 has aseparation part 65 a. Other configurations are the same as those of thesensor module 3A according to the ninth embodiment, so the samereference numerals are given to the same elements, and overlappingdescription will be omitted. In the present embodiment, the separationpart 65 a is formed in the corner part 41B₂ of the through holeformation area 41B. Assuming that a part of the top plate part 41 thatis covered with the filter 65 is referred to as “attachment area”, mostof the attachment area overlaps the through hole formation area 41B. Onthe other hand, assuming that a part of the top plate part 41 that isnot covered with the filter 65 is referred to as “non-attachment area”,the non-attachment area includes the center area 41A, outside area 41C,and a separation area 41D overlapping the through hole formation area41B and connecting the center area 41A and the outside area 41C.

FIGS. 20 and 21 are schematic perspective views for explaining a part ofthe manufacturing process of the sensor module 4A according to thefourteenth embodiment.

First, as illustrated in FIG. 20 , an aggregate substrate 10A mountedwith a large number of the sensor chips 20 and control ICs 30 isprepared, and the cases 40 are fixed to positions corresponding toindividual sensor modules 4A. In this state, a filter sheet 66 having alarge area is attached to the plurality of cases 40. The filter sheet 66has cuts, along which it can be separated into individual filters 65.

Then, as illustrated in FIG. 21 , an unnecessary part of the filtersheet 66 is removed so as to leave the individual filters 65 on thecases 40. Specifically, upon the removal, the filter sheet 66 is liftstarting from the separation area 41D side to separate the filters 65from unnecessary parts 66A, 66C, and 66D. That is, a point 66Pillustrated in FIGS. 20 and 21 is lifted. As a result, the unnecessarypart 66C covering the outside area 41C, the unnecessary part 66Dcovering the separation area 41D, and the unnecessary part 66A coveringthe center area 41A are removed in this order, allowing all theunnecessary parts 66A, 66C, and 66D to be removed in a single removalstep. Thereafter, the aggregate substrate 10A is diced into individualsensor modules 1A.

Thus, according to the sensor module 4A of the fourteenth embodiment,the removal process of the filter sheet 66 can be simplified. To preventunintended peeling of the filter 65 during the removal process of thefilter sheet 66, it is preferable to chamfer the edge portion of thefilter 65 positioned at the boundary between the outside area 41C andthe separation area 41D, as illustrated in FIGS. 22A to 22C. In theexample illustrated in FIG. 22A, the edge portion of the filter 65 islinearly chamfered. In the example illustrated in FIG. 22B, the edgeportion of the filter 65 is chamfered in a circular arc shape. In theexample illustrated in FIG. 22C, the edge portion of the filter 65 ischamfered in a linear shape, and the resultant corner portion is furtherchamfered in a circular arc shape. The dashed line in FIGS. 22A to 22Cdenotes the chamfered portion.

To facilitate the removal of the unnecessary part 66D, it is preferableto make the width of the separation area 41D wider from the center area41A toward the outside area 41C, as illustrated in FIGS. 23A and 23B. Inthe example illustrated in FIG. 23A, the width of the separation area41D becomes continuously wider from the center area 41A toward theoutside area 41C. In the example illustrated in FIG. 23B, the edgeportion of the filter 65 is largely chamfered in a circular arc shape,whereby the width of the separation area 41D is locally enlarged in thevicinity of the outside area 41C. The dashed line in FIGS. 23A and 23Bdenotes the position of the separation area 41D before being enlarged inwidth.

Fifteenth Embodiment

FIG. 24 is a schematic plan view illustrating the outer appearance of asensor module 4B according to a fifteenth embodiment of the presentinvention.

The sensor module 4B illustrated in FIG. 24 differs from the sensormodule 4A according to the fourteenth embodiment in that the separationpart 65 a of the filter 65 is formed in the linear part 41B₁ of thethrough hole formation area 41B. Other configurations are the same asthose of the sensor module 4A according to the fourteenth embodiment, sothe same reference numerals are given to the same elements, andoverlapping description will be omitted. As exemplified in the presentembodiment, the separation part 65 a of the filter 65 may notnecessarily be formed in the corner part 41B₂.

To prevent unintended peeling of the filter 65 in the removal process ofthe filter sheet 66, it is preferable to chamfer the edge portion of thefilter 65 positioned at the boundary between the outside area 41C andthe separation area 41D, as illustrated in FIGS. 25A to 25C. In theexample illustrated in FIG. 25A, the edge portion of the filter 65 islinearly chamfered. In the example illustrated in FIG. 25B, the edgeportion of the filter 65 is chamfered in a circular arc shape. In theexample illustrated in FIG. 25C, the edge portion of the filter 65 ischamfered in a linear shape, and the resultant corner portion is furtherchamfered in a circular arc shape. The dashed line in FIGS. 25A to 25Cdenotes the chamfered portion.

To facilitate the removal of unnecessary part 66D, it is preferable tomake the width of the separation area 41D wider from the center area 41Atoward the outside area 41C, as illustrated in FIGS. 26A and 26B. In theexample illustrated in FIG. 26A, the width of the separation area 41Dbecomes continuously wider from the center area 41A toward the outsidearea 41C. In the example illustrated in FIG. 26B, the edge portion ofthe filter 65 is largely chamfered in a circular arc shape, whereby thewidth of the separation area 41D is locally enlarged in the vicinity ofthe outside area 41C. The dashed line in FIGS. 26A and 26B denotes theposition of the separation area 41D before being enlarged in width.

Sixteenth Embodiment

FIG. 27 is a schematic plan view illustrating the outer appearance of asensor module 4C according to a sixteenth embodiment of the presentinvention.

The sensor module 4C illustrated in FIG. 27 differs from the sensormodule 4B according to the fifteenth embodiment in that the top platepart 41 of the case 40 has a circular shape. Other configurations arethe same as those of the sensor module 4B according to the fifteenthembodiment, so the same reference numerals are given to the sameelements, and overlapping description will be omitted. As exemplified inthe present embodiment, the top plate part 41 of the case 40 may notnecessarily have a rectangular shape in the present invention. Using thecase 40 having the circular top plate part 41 can further enhancemechanical strength.

It is apparent that the present invention is not limited to the aboveembodiments, but may be modified and changed without departing from thescope and spirit of the invention.

What is claimed is:
 1. A sensor module comprising: a substrate having atop surface, the top surface having first and second regions; a firstsensor chip mounted on the first region of the top surface of thesubstrate; a control IC mounted on the second region of the top surfaceof the substrate and electrically connected to the first sensor chip;and a case fixed to the substrate so as to cover the first sensor chipand the control IC, wherein the case has a plurality of through holes.2. The sensor module as claimed in claim 1, wherein the plurality ofthrough holes includes a first through hole that overlaps the firstsensor chip.
 3. The sensor module as claimed in claim 2, wherein theplurality of through holes further includes a second through hole thatoverlaps the control IC.
 4. The sensor module as claimed in claim 3,further comprising a second sensor chip electrically connected to thecontrol IC, wherein the top surface further has a third region on whichthe second sensor chip is mounted.
 5. The sensor module as claimed inclaim 4, wherein the plurality of through holes further includes a thirdthrough hole that overlaps the second sensor chip.
 6. The sensor moduleas claimed in claim 5, wherein the plurality of through holes furtherincludes a plurality of fourth through holes that do not overlap thefirst sensor chip, the second sensor chip, and the control IC.
 7. Thesensor module as claimed in claim 6, wherein the first and third throughholes are arranged along a first virtual line extending in a firstdirection, and wherein the plurality of fourth through holes arearranged along a second virtual line extending in a second directiondifferent from the first direction.
 8. The sensor module as claimed inclaim 7, wherein the plurality of through holes further includes aplurality of fifth through holes that do not overlap the first sensorchip, the second sensor chip, and the control IC, and wherein theplurality of fifth through holes are arranged along a third virtual lineextending in parallel with the second virtual line.
 9. The sensor moduleas claimed in claim 8, wherein the case has a center area positionedbetween the plurality of fourth through holes and the plurality of fifththrough holes in the first direction, and wherein the center area of thecase has no through hole.
 10. The sensor module as claimed in claim 9,wherein the center area of the case is positioned between the first andthird through holes and the second through hole in the second direction.11. A sensor module comprising: a substrate having a top surface havinga rectangular planar shape; a first sensor chip mounted on the topsurface of the substrate; a case fixed to the substrate so as to coverthe first sensor chip, wherein the case has: a plurality of firstthrough holes arranged along a first virtual line extending in a firstdirection; a plurality of second through holes arranged along a secondvirtual line extending in parallel with the first virtual line; aplurality of third through holes arranged along a third virtual linesubstantially perpendicular to the first and second virtual lines; and aplurality of fourth through holes arranged along a fourth virtual lineextending in parallel with the third virtual line, and wherein one ofthe plurality of first through holes overlaps the first sensor chip. 12.The sensor module as claimed in claim 11, wherein the case has a centerarea positioned between the plurality of first through holes and theplurality of second through holes in the second direction and positionedbetween the plurality of third through holes and the plurality of fourththrough holes in the first direction, and wherein the center area of thecase has no through hole.
 13. The sensor module as claimed in claim 12,wherein the case further has: a first corner area at which the first andthird virtual lines cross each other; a second corner area at which thefirst and fourth virtual lines cross each other; a third corner area atwhich the second and third virtual lines cross each other; and a fourthcorner area at which the second and fourth virtual lines cross eachother, and wherein the first, second, third, and fourth corner areas ofthe case have no through hole.
 14. The sensor module as claimed in claim11, further comprising a control IC mounted on the top surface of thesubstrate and electrically connected to the first sensor chip, whereinthe covers the first sensor chip and the control IC.
 15. The sensormodule as claimed in claim 14, wherein at least one of the plurality ofsecond through holes overlaps the control IC.
 16. The sensor module asclaimed in claim 15, wherein each of the plurality of second throughholes overlaps the control IC.
 17. The sensor module as claimed in claim14, wherein the plurality of third through holes and the plurality offourth through holes do not overlap the first sensor chip and thecontrol IC.
 18. The sensor module as claimed in claim 14, furthercomprising a second sensor chip mounted on the top surface of thesubstrate and electrically connected to the control IC, wherein anotherone of the plurality of first through holes overlap the second sensorchip.